Cite
HARVARD Citation
Yang, B. et al. (2019). A novel liquid imidazole-copper (II) complex as a thermal latent curing agent for epoxy resins. Polymer. p. . [Online].
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Yang, B. et al. (2019). A novel liquid imidazole-copper (II) complex as a thermal latent curing agent for epoxy resins. Polymer. p. . [Online].