Formation of typical Cu–Ti intermetallic phases via a liquid-solid reaction approach. (October 2019)
- Record Type:
- Journal Article
- Title:
- Formation of typical Cu–Ti intermetallic phases via a liquid-solid reaction approach. (October 2019)
- Main Title:
- Formation of typical Cu–Ti intermetallic phases via a liquid-solid reaction approach
- Authors:
- Fan, Yonggang
Fan, Junxiang
Wang, Cong - Abstract:
- Abstract: Cu–Ti intermetallic compounds are usually prepared by solid-solid Cu/Ti diffusion couples. However, we offer a rather unique approach to prepare Cu–Ti phases by simply mixing Cu and Ti powders and heating them at 1373 K. Typical CuTi2, CuTi and Cu4 Ti3 phases are profusely formed. Intermetallic stoichiometry, morphology and the sequence of nucleation and growth between them are discussed in detail. Meanwhile, pertinent properties, such as hardness and fracture toughness are characterized. It is believed such technique may pave a way for faster production of Cu–Ti alloys with fine-tuned properties. Graphical abstract: Fig. 1 (a) SEM micrograph and accompanying EDS point analysis (atomic percentage) of the solidified Cu–Ti alloy (1373 K, 30 min), (b) typical morphology of CuTi2 (magnified image of the red dashed line area in (a)), (c) typical microstructure of CuTi (magnified image of the green dashed line area in (a)), and (d) typical morphology of Cu4Ti3 (magnified image of the yellow dashed line area in (a)). Figure 3 Micrographs of Cu–Ti alloy intermetallic compounds after microhardness test: (a) micrograph of indented CuTi2, (b) micrograph of indented CuTi, and (c) micrograph of indented Cu4Ti3.Image 1 Highlights: Typical Cu–Ti intermetallic phases, namely, CuTi2, CuTi and Cu4 Ti3, are formed via a fast liquid-solid reaction approach. Large grain sizes of such phases enable the evaluation of pertinent properties such as microhardness and fracture toughness.Abstract: Cu–Ti intermetallic compounds are usually prepared by solid-solid Cu/Ti diffusion couples. However, we offer a rather unique approach to prepare Cu–Ti phases by simply mixing Cu and Ti powders and heating them at 1373 K. Typical CuTi2, CuTi and Cu4 Ti3 phases are profusely formed. Intermetallic stoichiometry, morphology and the sequence of nucleation and growth between them are discussed in detail. Meanwhile, pertinent properties, such as hardness and fracture toughness are characterized. It is believed such technique may pave a way for faster production of Cu–Ti alloys with fine-tuned properties. Graphical abstract: Fig. 1 (a) SEM micrograph and accompanying EDS point analysis (atomic percentage) of the solidified Cu–Ti alloy (1373 K, 30 min), (b) typical morphology of CuTi2 (magnified image of the red dashed line area in (a)), (c) typical microstructure of CuTi (magnified image of the green dashed line area in (a)), and (d) typical morphology of Cu4Ti3 (magnified image of the yellow dashed line area in (a)). Figure 3 Micrographs of Cu–Ti alloy intermetallic compounds after microhardness test: (a) micrograph of indented CuTi2, (b) micrograph of indented CuTi, and (c) micrograph of indented Cu4Ti3.Image 1 Highlights: Typical Cu–Ti intermetallic phases, namely, CuTi2, CuTi and Cu4 Ti3, are formed via a fast liquid-solid reaction approach. Large grain sizes of such phases enable the evaluation of pertinent properties such as microhardness and fracture toughness. CuTi2 is brittle in nature and exhibits an extremely symmetrical cracking pattern. Cu4 Ti3 and CuTi are found to be ductile. … (more)
- Is Part Of:
- Intermetallics. Volume 113(2019:Oct.)
- Journal:
- Intermetallics
- Issue:
- Volume 113(2019:Oct.)
- Issue Display:
- Volume 113 (2019)
- Year:
- 2019
- Volume:
- 113
- Issue Sort Value:
- 2019-0113-0000-0000
- Page Start:
- Page End:
- Publication Date:
- 2019-10
- Subjects:
- Cu–Ti -- Intermetallic compounds -- Liquid-solid reaction -- Fracture toughness
Intermetallic compounds -- Metallography -- Periodicals
Metallic glasses -- Periodicals
Composés intermétalliques -- Métallographie -- Périodiques
669.94 - Journal URLs:
- http://www.sciencedirect.com/science/journal/09669795 ↗
http://www.elsevier.com/journals ↗ - DOI:
- 10.1016/j.intermet.2019.106577 ↗
- Languages:
- English
- ISSNs:
- 0966-9795
- Deposit Type:
- Legaldeposit
- View Content:
- Available online (eLD content is only available in our Reading Rooms) ↗
- Physical Locations:
- British Library DSC - 4534.562000
British Library DSC - BLDSS-3PM
British Library HMNTS - ELD Digital store - Ingest File:
- 11422.xml