Investigation of high cyclic fatigue behaviour of thin copper films using MEMS structure. (November 2019)

• Record Type: Journal Article
• Authors: Saghaeian, F.; Lederer, M.; Hofer, A.; Todt, J.; Keckes, J.; Khatibi, G.
• Is Part Of: International journal of fatigue. Volume 128(2019)
• Publication Date: 2019-11
• Subjects: High cycle fatigue -- Reliability -- MEMS -- Electronic material -- Microstructures; Materials -- Fatigue -- Periodicals; Materials -- Fatigue; Periodicals; 620.1122
• DOI: 10.1016/j.ijfatigue.2019.06.039
• Languages: English
• ISSNs: 0142-1123

Abstract

Highlights: Investigation of high cyclic fatigue behavior of nano crystalline thin copper film. Establishment of MEMS based platform for investigating fatigue of thin films. Simulation of MEMS structures for loading thin film with concentrated cyclic load. Study of grain growth and crystal reorientation using inverse pole figures. Characterization of fatigue in thin films on silicon structures. Abstract: Fatigue failure of thin metal films used in semiconductor devices poses a serious problem for their structural integrity over the lifetime. In present study, specially designed MEMS based plus structures are fabricated and used to investigate fatigue behavior of thin copper film under cyclic mechanical load. FEM Analysis was employed to assess stress distributions under vibration loading. Under cyclic mechanical loading, plus structures reveal cyclic plastic deformation, together with grain coarsening and change in crystal orientation at the location of stress concentration predicted in simulation. It was found that a reduction in thickness enhances the fatigue resistance of copper films.