Cite
HARVARD Citation
Zhao, J. et al. (n.d.). A low feed-through 3D vacuum packaging technique with silicon vias for RF MEMS resonators. Journal of micromechanics and microengineering. p. . [Online].
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Zhao, J. et al. (n.d.). A low feed-through 3D vacuum packaging technique with silicon vias for RF MEMS resonators. Journal of micromechanics and microengineering. p. . [Online].