Cite
HARVARD Citation
Tseng, V. et al. (n.d.). 3D electroplated inductors with thickness variation for improved broadband performance. Journal of micromechanics and microengineering. p. . [Online].
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Tseng, V. et al. (n.d.). 3D electroplated inductors with thickness variation for improved broadband performance. Journal of micromechanics and microengineering. p. . [Online].