Cite
HARVARD Citation
Zhang, H. et al. (2018). A new hermetic sealing method for ceramic package using nanosilver sintering technology. Microelectronics and reliability. pp. 143-149. [Online].
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Zhang, H. et al. (2018). A new hermetic sealing method for ceramic package using nanosilver sintering technology. Microelectronics and reliability. pp. 143-149. [Online].