Cite
HARVARD Citation
Msolli, S. et al. (2018). Identification of damage and fracture modes in power electronic packaging from experimental micro-shear tests and finite element modeling. Engineering fracture mechanics. pp. 470-492. [Online].
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Msolli, S. et al. (2018). Identification of damage and fracture modes in power electronic packaging from experimental micro-shear tests and finite element modeling. Engineering fracture mechanics. pp. 470-492. [Online].