Enhancing Interconnect Reliability and Performance by Converting Tantalum to 2D Layered Tantalum Sulfide at Low Temperature. Issue 30 (11th June 2019)

• Record Type: Journal Article
• Authors: Lo, Chun‐Li; Catalano, Massimo; Khosravi, Ava; Ge, Wanying; Ji, Yujin; Zemlyanov, Dmitry Y.; Wang, Luhua; Addou, Rafik; Liu, Yuanyue; Wallace, Robert M.; Kim, Moon J.; Chen, Zhihong
• Is Part Of: Advanced materials. Volume 31:Issue 30(2019)
• Page Start: n/a
• Page End: n/a
• Publication Date: 2019-06-11
• Subjects: 2D materials -- Cu diffusion -- interconnects -- reliability; Materials -- Periodicals; Chemical vapor deposition -- Periodicals; 620.11
• DOI: 10.1002/adma.201902397
• Languages: English
• ISSNs: 0935-9648

Abstract

Abstract: The interconnect half‐pitch size will reach ≈20 nm in the coming sub‐5 nm technology node. Meanwhile, the TaN/Ta (barrier/liner) bilayer stack has to be >4 nm to ensure acceptable liner and diffusion barrier properties. Since TaN/Ta occupy a significant portion of the interconnect cross‐section and they are much more resistive than Cu, the effective conductance of an ultrascaled interconnect will be compromised by the thick bilayer. Therefore, 2D layered materials have been explored as diffusion barrier alternatives. However, many of the proposed 2D barriers are prepared at too high temperatures to be compatible with the back‐end‐of‐line (BEOL) technology. In addition, as important as the diffusion barrier properties, the liner properties of 2D materials must be evaluated, which has not yet been pursued. Here, a 2D layered tantalum sulfide (TaS x ) with ≈1.5 nm thickness is developed to replace the conventional TaN/Ta bilayer. The TaS x ultrathin film is industry‐friendly, BEOL‐compatible, and can be directly prepared on dielectrics. The results show superior barrier/liner properties of TaS x compared to the TaN/Ta bilayer. This single‐stack material, serving as both a liner and a barrier, will enable continued scaling of interconnects beyond 5 nm node. Abstract : A 1.5 nm 2D layered tantalum sulfide diffusion barrier/liner for Cu interconnects is developed by converting tantalum at 400 °C. Superior diffusion barrier and liner properties are demonstrated as compared to standard barrier/liner. A bottleneck of interconnect scaling can be overcome by replacing conventional barrier/liner bilayer with a single‐stack of tantalum sulfide.