Cite
HARVARD Citation
Cheng, P. et al. (2019). Enhanced thermal stability by introducing TiN diffusion barrier layer between W and SiC. Journal of the American Ceramic Society. 102 (9), pp. 5613-5619. [Online].
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Cheng, P. et al. (2019). Enhanced thermal stability by introducing TiN diffusion barrier layer between W and SiC. Journal of the American Ceramic Society. 102 (9), pp. 5613-5619. [Online].