Thermally conductive adhesives from covalent-bonding of reduced graphene oxide to acrylic copolymer. Issue 10 (24th August 2019)

• Record Type: Journal Article
• Authors: Vu, Minh Canh; Bae, Young Han; Yu, Min Ji; Choi, Won-Kook; Islam, Md. Akhtarul; Kim, Sung-Ryong
• Is Part Of: Journal of adhesion. Volume 95:Issue 10(2019)
• Page Start: 887
• Page End: 910
• Publication Date: 2019-08-24
• Subjects: Adhesion by chemical bonding -- conductive adhesion -- pressure-sensitive -- surface modification; Adhesion -- Periodicals; 541.33
• DOI: 10.1080/00218464.2018.1451331
• Languages: English
• ISSNs: 0021-8464

Abstract

ABSTRACT: This work reports about the enhancement of the thermal conductivity of an acrylic pressure-sensitive adhesive (PSA) with the incorporation of functionalized and reduced graphene oxide (frGO) sheet in the composition. Bifunctional isocyanatoethylmetharcylate (IEMA) was intercalated (so-called 'functionalization') to the GO surface mainly at its –COOH sites. The remaining oxygenated groups on the GO surface were reduced by dimethyl hydrazine. The frGO was successfully incorporated into PSA matrix through in-situ polymerization of acrylic monomers and subsequently crosslinked under UV radiation. The conductivity and the peel strength of the PSA were studied as a function of filler content, filler modification (functionalization and/or reduction), UV-radiation dosage and mode of filler insertion (through in-situ polymerization or mechanical mixing). frGO/PSA showed much better properties than the PSA system with bare or IEMA-functionalized unreduced GO. In-situ polymerization was found to be more effective method for frGO insertion. Within the range of filler content (0.0–1.0) wt% and UV-radiation dosages of (400–3000) mJcm −2, the thermal conductivity and peel strength of the acrylic PSA-system under investigation varied in the range of 0.17–1.03 Wm −1 K −1 and 2831–299 gf /25 mm. This is the first report on 'reduced GO covalently bonded to polymer chain in an adhesive-composition' providing novel idea to make PSA-system with balanced thermal conductivity and peel strength with perspective for application in miniature electronic industries.