Computer-aided analysis of grain-boundary connectivity of B10 copper-nickel alloys. (3rd April 2019)

• Record Type: Journal Article
• Authors: Dong, Yuehua; Zhou, Yongxin; Feng, Xingyu; Wang, Zhigang; Wang, Hang
• Is Part Of: Philosophical magazine letters. Volume 99:Number 4(2019)
• Page Start: 146
• Page End: 156
• Publication Date: 2019-04-03
• Subjects: B10 copper-nickel alloy -- grain-boundary triple junction -- grain boundary connectivity -- numerical method -- corrosion resistance; Condensed matter -- Periodicals; Physics -- Periodicals; Solid state physics -- Periodicals; Physique -- Périodiques; 530.41
• DOI: 10.1080/09500839.2019.1640402
• Languages: English
• ISSNs: 0950-0839

Abstract

ABSTRACT: A numerical calculation method based on the angle in a triple junction composed of a random grain boundary is proposed to predict the connectivity and stability of a grain boundary in a B10 copper-nickel alloy. The grain-boundary connectivity and its effect on corrosion resistance are studied combining computer-aided analysis with electrochemical impedance testing. The results show that the prediction of corrosion resistance using a grain-boundary connectivity numerical method is consistent with immersion experimental results. The B10 alloy exhibited the best corrosion resistance after cold rolling with a 9% reduction rate. The relationship between the grain-boundary characteristics and corrosion resistance is well established using the numerical method to quantify the grain-boundary connectivity. A higher connective frequency and a low proportion of grain-boundary angles between 60° and 180° in the triple junction is detrimental to corrosion resistance of the B10 alloy.