15.3: Roll‐to‐Roll Fine Copper Circuit Patterning Solutions. (28th November 2018)

• Record Type: Journal Article
• Authors: Chung, Sheng-Hsuan; Lin, Chia-Hui; Hsu, Ming-Ann; Igawa, Akihiko; Hsieh, Tung-Hung
• Is Part Of: Digest of technical papers. Volume 49(2018)Supplement 1
• Page Start: 161
• Page End: 163
• Publication Date: 2018-11-28
• Subjects: Roll-to-roll -- positive photoresist -- etching -- semi additive process; Information display systems -- Congresses; 621.3815422
• DOI: 10.1002/sdtp.12667
• Languages: English
• ISSNs: 0097-966X

Abstract

Abstract : Fine copper circuit on flexible substrate is highly demanded components for flexible displays. Two methods have been developed for making high resolution (7um, L/S) circuits with copper thickness up to 10 um: positive‐tone photolithography/wet etching, and semi‐additive photolithography/plating/flash etching processes. High throughput roll‐to‐roll process can be applied using both methods with proprietary positive‐tone photoresists for manufacturing flexible backplane and connector circuits.