Optoelectronic Devices: Thin Metallic Heat Sink for Interfacial Thermal Management in Biointegrated Optoelectronic Devices (Adv. Mater. Technol. 11/2018). Issue 11 (16th November 2018)

• Record Type: Journal Article
• Authors: Jung, Han Hee; Song, Juwon; Nie, Shuang; Jung, Han Na; Kim, Min Seok; Jeong, Jae‐Woong; Song, Young Min; Song, Jizhou; Jang, Kyung‐In
• Is Part Of: Advanced materials technologies. Volume 3:Issue 11(2018)
• Page Start: n/a
• Page End: n/a
• Publication Date: 2018-11-16
• Subjects: III‐V optoelectronics -- flexible electronics -- heat dissipation -- pulse oximetry -- thermal damage; Materials science -- Periodicals; Technological innovations -- Periodicals; Materials science; Technological innovations; Periodicals; 620.1105
• DOI: 10.1002/admt.201870040
• Languages: English
• ISSNs: 2365-709X

Abstract

Abstract : In article number1800159, Young Min Song, Jizhou Song, Kyung‐In Jang, and co‐workers develop a bio‐integrated optoelectronic device with integration of thin metallic heat sink for interfacial thermal management. It exhibits excellent heat dissipation capabilities for thermally safe long‐term usability, due to the high thermal conductivity and film‐type geometrical design of the heat sink for skin applications. The architecture of the device with the metallic heat sink ensures mechanically and thermally invisible blood flow monitoring.