Cite
HARVARD Citation
Lin, Y. et al. (n.d.). Leakage current conduction mechanism of three-dimensional capacitors embedded in through-silicon vias. Japanese journal of applied physics. p. . [Online].
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Lin, Y. et al. (n.d.). Leakage current conduction mechanism of three-dimensional capacitors embedded in through-silicon vias. Japanese journal of applied physics. p. . [Online].