Interface structure and properties of CNTs/Cu composites fabricated by electroless deposition and spark plasma sintering. (5th January 2018)

• Record Type: Journal Article
• Authors: Wang, Hu; Zhang, Zhao-Hui; Hu, Zheng-Yang; Song, Qi; Yin, Shi-Pan
• Is Part Of: Materials research express. Volume 5:Number 1(2018)
• Publication Date: 2018-01-05
• Subjects: carbon nanotubes -- copper matrix composites -- interface structure -- electroless deposition -- spark plasma sintering; Materials science -- Research -- Periodicals; Materials science -- Periodicals; 620.11
• DOI: 10.1088/2053-1591/aaa167
• Languages: English
• ISSNs: 2053-1591

Abstract

Abstract: In this paper, we fabricated a novel copper matrix composites reinforced by carbon nanotubes (CNTs) using electroless deposition (ED) and spark plasma sintering technique. Microstructure, mechanical, electric conductivity, and thermal properties of the CNTs/Cu composites were investigated. The results show that a favorable interface containing C–O and O–Cu bond was formed between CNTs and matrix when the CNTs were coated with nano-Cu by ED method. Thus, we accomplished the uniformly dispersed CNTs in the CNTs/Cu powders and compacted composites, which eventually leads to the enhancement of the mechanical properties of the CNTs/Cu composites in the macro-scale environment. However, the interface structure can hinder the movement of carriers and free electrons and increase the interface thermal resistance, which leads to modest decrease of electrical and thermal conductivity of the CNTs/Cu composites.