Selective hierarchical patterning of silicon nanostructures via soft nanostencil lithography. (23rd October 2017)

• Record Type: Journal Article
• Authors: Du, Ke; Ding, Junjun; Wathuthanthri, Ishan; Choi, Chang-Hwan
• Is Part Of: Nanotechnology. Volume 28:Number 46(2017)
• Publication Date: 2017-10-23
• Subjects: nanostencil lithography -- hierarchical nanostructures -- free-standing membrane; Nanotechnology -- Periodicals; Nanotechnology -- Periodicals; Nanotechnology; Publications périodiques; Nanotechnologies; Periodicals; 620.5
• DOI: 10.1088/1361-6528/aa8ce8
• Languages: English
• ISSNs: 0957-4484

Abstract

Abstract: It is challenging to hierarchically pattern high-aspect-ratio nanostructures on microstructures using conventional lithographic techniques, where photoresist (PR) film is not able to uniformly cover on the microstructures as the aspect ratio increases. Such non-uniformity causes poor definition of nanopatterns over the microstructures. Nanostencil lithography can provide an alternative means to hierarchically construct nanostructures on microstructures via direct deposition or plasma etching through a free-standing nanoporous membrane. In this work, we demonstrate the multiscale hierarchical fabrication of high-aspect-ratio nanostructures on microstructures of silicon using a free-standing nanostencil, which is a nanoporous membrane consisting of metal (Cr), PR, and anti-reflective coating. The nanostencil membrane is used as a deposition mask to define Cr nanodot patterns on the predefined silicon microstructures. Then, deep reactive ion etching is used to hierarchically create nanostructures on the microstructures using the Cr nanodots as an etch mask. With simple modification of the main fabrication processes, high-aspect-ratio nanopillars are selectively defined only on top of the microstructures, on bottom, or on both top and bottom.