High thermal conductivity of hexagonal boron nitride laminates. (18th January 2016)

• Record Type: Journal Article
• Authors: Zheng, Jin-Cheng; Zhang, Liang; Kretinin, A V; Morozov, S V; Wang, Yi Bo; Wang, Tun; Li, Xiaojun; Ren, Fei; Zhang, Jingyu; Lu, Ching-Yu; Chen, Jia-Cing; Lu, Miao; Wang, Hui-Qiong; Geim, A K; Novoselov, K S
• Is Part Of: 2D materials. Volume 3:Number 1(2016)
• Publication Date: 2016-01-18
• Subjects: hexagonal boron nitride -- laminates -- thermal conductivity -- nanocomposites -- heat spreaders -- liquid-phase exfoliation -- thermal management; 65.80.-g -- 81.05.Rm -- 44.05.+e -- 44.10.+I; Graphene -- Periodicals; Materials science -- Periodicals; Nanostructured materials -- Periodicals; 620.115
• DOI: 10.1088/2053-1583/3/1/011004
• Languages: English
• ISSNs: 2053-1583

Abstract

Abstract: Two-dimensional materials are characterised by a number of unique physical properties which can potentially make them useful to a wide diversity of applications. In particular, the large thermal conductivity of graphene and hexagonal boron nitride (hBN) has already been acknowledged and these materials have been suggested as novel core materials for thermal management in electronics. However, it was not clear if mass produced flakes of hBN would allow one to achieve an industrially-relevant value of thermal conductivity. Here we demonstrate that laminates of hBN exhibit thermal conductivity of up to 20 W/m·K, which is significantly larger than that currently used in thermal management. We also show that the thermal conductivity of laminates increases with the increasing volumetric mass density, which creates a way of fine tuning its thermal properties.