Effects of polyamide 6 reinforcement on the compatibility of high‐density polyethylene/environmental‐friendly modified wood fiber composites. Issue 38 (18th May 2019)

• Record Type: Journal Article
• Authors: Xu, Kaimeng; Zheng, Zhifeng; Du, Guanben; Zhang, Yulu; Wang, Zhihui; Zhong, Tuhua; Xie, Linkun; Wang, Siqun
• Is Part Of: Journal of applied polymer science. Volume 136:Issue 38(2019)
• Page Start: n/a
• Page End: n/a
• Publication Date: 2019-05-18
• Subjects: compatibility -- environmental‐friendly modified wood fiber -- high‐density polyethylene -- Polyamide 6; Polymers -- Periodicals; Polymerization -- Periodicals; 668.9
• DOI: 10.1002/app.47984
• Languages: English
• ISSNs: 0021-8995

Abstract

ABSTRACT: In order to develop excellent comprehensive mechanical strength and stability in high‐density polyethylene (HDPE)/wood fiber (WF) composites, polyamide 6 (PA 6), and WF modified by environmental‐friendly high temperature vapor (WF‐HTV) were utilized to reinforce the compound system. The properties relating to interfacial compatibility in HDPE/WF‐HTV composites were characterized and evaluated by electron universal mechanical instrument, water absorption testing, thermogravimetry, scanning electron microscope, Fourier transfer infrared spectroscopy, and differential scanning calorimetry. The results reveal that this novel compounding system can engender a synergistic effect for interfacial interactions among PA 6, HDPE, and WF‐HTV only when the ratio of HDPE to PA 6 is at an optimum level (HDPE:PA 6 = 6:4). The maximum values for flexural strength, modulus, tensile strength, and impact strength can be increased by 82.05, 64.08, 93.47, and 120.45%, respectively, compared with those of HDPE/WF‐HTV composites. Additionally, maximum decomposition temperatures for the first and second thermal degradation stages can be increased by 7.17and 8.99 °C, respectively. Water absorption can be effectively controlled at a relatively low level (approximately 1.50%). © 2019 Wiley Periodicals, Inc. J. Appl. Polym. Sci.2019, 136, 47984. Abstract :