Silicon pixel R&D for CLIC. (31st January 2017)

• Record Type: Journal Article
• Authors: Munker, M.
• Is Part Of: Journal of instrumentation. Volume 12:Number 1(2017:Jan.)
• Page Start: C01096
• Page End: C01096
• Publication Date: 2017-01-31
• Subjects: Electronic detector readout concepts (solid-state) -- Hybrid detectors -- Solid state detectors; Scientific apparatus and instruments -- Periodicals; 502.84
• DOI: 10.1088/1748-0221/12/01/C01096
• Languages: English
• ISSNs: 1748-0221

Abstract

Abstract: Challenging detector requirements are imposed by the physics goals at the future multi-TeV e + e − Compact Linear Collider (CLIC). A single point resolution of 3 μm for the vertex detector and 7 μm for the tracker is required. Moreover, the CLIC vertex detector and tracker need to be extremely light weighted with a material budget of 0.2% X 0 per layer in the vertex detector and 1 – 2% X 0 in the tracker. A fast time slicing of 10 ns is further required to suppress background from beam-beam interactions. A wide range of sensor and readout ASIC technologies are investigated within the CLIC silicon pixel R&D effort. Various hybrid planar sensor assemblies with a pixel size of 25×25 μm 2 and 55×55 μm 2 have been produced and characterised by laboratory measurements and during test-beam campaigns. Experimental and simulation results for thin ( 50 μm – 500 μm ) slim edge and active-edge planar, and High-Voltage CMOS sensors hybridised to various readout ASICs (Timepix, Timepix3, CLICpix) are presented.