Nanomeshes at Liquid Interfaces: From Free‐Standing Hole Arrays toward Metal–Insulator–Metal Architectures. Issue 10 (12th March 2018)

• Record Type: Journal Article
• Authors: Stelling, Christian; Retsch, Markus
• Is Part Of: Advanced materials interfaces. Volume 5:Issue 10(2018)
• Page Start: n/a
• Page End: n/a
• Publication Date: 2018-03-12
• Subjects: free‐standing films -- interface transfer -- nanohole arrays -- plasma etching -- surface plasmon polariton; Materials science -- Periodicals; 620.11
• DOI: 10.1002/admi.201800154
• Languages: English
• ISSNs: 2196-7350

Abstract

Abstract: The superior optical properties of metamaterials often rely on hierarchical structures in the sub‐wavelength regime comprising stacks of individually patterned layers. For the fabrication of metamaterials in the visible regime, specific top‐down lithographic methods have been developed. These techniques, however, have several inherent drawbacks such the lack of scalability and low production speeds. Here, a simple and modular approach for the construction of multilayer metal–insulator–metal structures based on the transfer of metal nanohole arrays via liquid interfaces is demonstrated. Gold nanohole arrays are used as model systems that are prepared via nanosphere lithography on a zinc oxide sacrificial layer. Exploiting an interface mediated method, the prepared nanohole arrays are subsequently transferred onto arbitrary hydrophilic or hydrophobic substrates without compromising the high quality of the nanomeshes. Two approaches to stack such nanostructured layers with nanometer precision in a rapid way are demonstrated. Finally, the high mechanical stability of only 100 nm thick gold nanohole arrays allows for the preparation of free‐standing nanomeshes in the order of several hundreds of square‐micrometers. Abstract : The interface‐mediated transfer of gold nanohole arrays prepared via nanosphere lithography on zinc oxide sacrificial layers is shown. The high mechanical stability of the nanohole arrays allows for the preparation of free‐standing nanomeshes and multilayer metal–insulator–metal structures.