Cite
HARVARD Citation
Mei, J. et al. (2018). Effect of Joule heating on the reliability of solder joints under power cycling conditions. Microelectronics and reliability. pp. 684-690. [Online].
This is an interim version of our Electronic Legal Deposit Catalogue-eJournals and eBooks while we continue to recover from a cyber-attack.
Mei, J. et al. (2018). Effect of Joule heating on the reliability of solder joints under power cycling conditions. Microelectronics and reliability. pp. 684-690. [Online].