Cite
HARVARD Citation
Pascal, Y. et al. (2018). Experimental investigation of the reliability of Printed Circuit Board (PCB)-embedded power dies with pressed contact made of metal foam. Microelectronics and reliability. pp. 707-714. [Online].
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Pascal, Y. et al. (2018). Experimental investigation of the reliability of Printed Circuit Board (PCB)-embedded power dies with pressed contact made of metal foam. Microelectronics and reliability. pp. 707-714. [Online].