Cite
HARVARD Citation
Cavallaro, D. et al. (2018). Effect of solder material thickness on Power MOSFET reliability by Electro-thermo-Mechanical Simulations. Microelectronics and reliability. pp. 1168-1171. [Online].
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Cavallaro, D. et al. (2018). Effect of solder material thickness on Power MOSFET reliability by Electro-thermo-Mechanical Simulations. Microelectronics and reliability. pp. 1168-1171. [Online].