Cite
HARVARD Citation
Arabi, F. et al. (2018). Sequential combined thermal cycling and vibration test and simulation of printed circuit board. Microelectronics and reliability. pp. 768-773. [Online].
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Arabi, F. et al. (2018). Sequential combined thermal cycling and vibration test and simulation of printed circuit board. Microelectronics and reliability. pp. 768-773. [Online].