Heterostructure induced dispersive shear bands in heterostructured Cu. (September 2019)

• Record Type: Journal Article
• Authors: Wang, Y.F.; Huang, C.X.; He, Q.; Guo, F.J.; Wang, M.S.; Song, L.Y.; Zhu, Y.T.
• Is Part Of: Scripta materialia. Number 170(2019)
• Page Start: 76
• Page End: 80
• Publication Date: 2019-09
• Subjects: Heterostructure -- Shear banding -- Ductility -- Heterostructured domain boundary -- Microscale DIC; Materials -- Periodicals; Metallurgy -- Periodicals; Metalen; Legeringen; Materiaalkunde; Metals, metalworking and machinery industries; Metals; Electronic journals; 620.11
• DOI: 10.1016/j.scriptamat.2019.05.036
• Languages: English
• ISSNs: 1359-6462

Abstract

Abstract: Here we report the formation of dispersive shear bands in a heterostructured Cu composed of coarse-grained (CG) and ultrafine-grained (UFG) domains. Microscale digital image correlation revealed that dense shear bands evolved in a stable manner over the whole gauge section. Our observation suggests that the limited strain hardening of UFG domains and deformation heterogeneity promoted shear banding, which is a major deformation mechanism in heterostructured materials. The dispersive shear banding helped with ductility retention. Graphical abstract: Unlabelled Image