A novel fabrication method of copper–reduced graphene oxide composites with highly aligned reduced graphene oxide and highly anisotropic thermal conductivity. Issue 31 (7th June 2019)

• Record Type: Journal Article
• Authors: Nazeer, Faisal; Ma, Zhuang; Xie, Yitong; Gao, Lihong; Malik, Abdul; Khan, Muhammad Abubaker; Wang, Fuchi; Li, Hezhang
• Is Part Of: RSC advances. Volume 9:Issue 31(2019)
• Page Start: 17967
• Page End: 17974
• Publication Date: 2019-06-07
• Subjects: Chemistry -- Periodicals; 540.5
• DOI: 10.1039/c9ra03743h
• Languages: English
• ISSNs: 2046-2069

Abstract

Abstract : Highly aligned rGO with anisotropic thermal conductivity was obtained in this work. Abstract : Recently, metals with graphene and graphene oxide have been extensively used to enhance the mechanical and anisotropic thermal properties of composites. A novel facile fabrication approach of layer by layer self-assembly followed by hot press sintering was adopted to make copper–reduced graphene oxide composites. The microstructure and heat dissipation properties of pure copper and copper–reduced graphene oxide composites were analyzed with the help of SEM and continuous laser machine analysis. Thermal diffusivity of pure copper and copper–reduced graphene oxide composites was examined in different directions to measure the anisotropic thermal properties by using different volumetric percentages of reduced graphene oxide in the composites. Extraordinarily high anisotropic thermal conductivity of the copper–reduced graphene oxide composites was obtained at a very low concentration of 0.8 vol% reduced graphene oxide, with the difference between the thermal conductivity in-plane and through-plane being a factor of 8.82. Laser test results confirmed the highly anisotropic behavior of our copper–reduced graphene oxide composite with the remarkable property of heat dissipation. The three point bending test was also performed to check the flexural strength of the composites. At 0.6 vol% rGO, the flexural strength was noted (∼127 MPa), and it is 22% higher than that of pure sintered Cu. The high value of anisotropic thermal conductivity and higher flexural strength exhibited by the copper–reduced graphene oxide composite produced using a simple two-step fabrication method give us new hope to use these materials as heat sinks in thermal packaging systems.