Three-Dimensional Modeling of the Heat-Affected Zone in Laser Machining Applications. (22nd October 2008)

• Record Type: Journal Article
• Authors: Beresna, Martynas; Gertus, Titas; Tomašiūnas, Rolandas; Misawa, Hiroaki; Juodkazis, Saulius
• Other Names: Pissadakis Stavros Academic Editor.
• Is Part Of: Laser chemistry. Volume 2008(2008)
• Publication Date: 2008-10-22
• Subjects: Lasers in chemistry -- Periodicals; 542.8
• DOI: 10.1155/2008/976205
• Languages: English
• ISSNs: 0278-6273

Abstract

Abstract : Thermal load as well as its three-dimensional (3D) spatial distribution has been estimated inside representative materials: glass (low thermal diffusion), silicon (semimetal properties), and sapphire (a crystalline dielectric of a high thermal conductivity) for typical laser processing and direct laser writing applications. The 3D temperature distribution allows to calculate thermal stress around the focal region. This provides an assessment tool for optimization of laser microprocessing conditions for controlled laser dicing and cutting applications.