Synthesis of pyridine-containing diamine and properties of its polyimides and polyimide/hexagonal boron nitride composite films. (10th November 2017)

• Record Type: Journal Article
• Authors: Zhang, Shiheng; Li, Xiaoya; Guan, Xiaoxiao; Shi, Yancen; Wu, Kun; Liang, Liyan; Shi, Jun; Lu, Mangeng
• Is Part Of: Composites science and technology. Volume 152(2017)
• Page Start: 165
• Page End: 172
• Publication Date: 2017-11-10
• Subjects: Polymer-matrix composites (PMCs) -- Thermal properties -- Casting; Composite materials -- Periodicals; Composite materials; Fibrous composites; Periodicals; 620.118
• DOI: 10.1016/j.compscitech.2017.09.026
• Languages: English
• ISSNs: 0266-3538

Abstract

Abstract: A pyridine-containing diamine, 4, 4′-bis(5-amino-2-pyridinoxy)diphenyl ether, was prepared via a two-step procedure. Based on the diamine, a series of polyimides were prepared by traditional two-step method. The characteristic peaks of polyimides on their fourier transform infrared (FI-IR) spectra indicated full imidization. Thermogravimetric analysis (TGA), dynamical mechanical analysis (DMA), differential scanning calorimetry (DSC) and ultraviolet–visible (UV-vis) spectra data showed that the polyimides displayed good properties. Polyimide/hexagonal boron nitride (PI/hBN) composite films were prepared, 3, 3′, 4, 4′-benzophenonetetracarboxylic dianhydride based polyimide(PI-2) was used as the matrix. In addition, the effects of hBN content on the thermal conductivity (TC) of PI/hBN composites films were investigated. The TC of purePI-2 was 0.148 W m −1 K −1, when the hBN content increased to 40 wt %, the TC increased to 0.686 W m −1 K −1 . The enhancement in this TC value was as high as 460% compared to purePI-2 . Meanwhile, the PI/hBN composites films retained excellent thermal and dynamic mechanical properties.