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HARVARD Citation
Kim, J. et al. (2017). Effect of bonding parameters on microstructural characteristics during TLP bonding of directionally solidified Ni-based superalloy. Journal of manufacturing processes. pp. 208-216. [Online].
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Kim, J. et al. (2017). Effect of bonding parameters on microstructural characteristics during TLP bonding of directionally solidified Ni-based superalloy. Journal of manufacturing processes. pp. 208-216. [Online].