Cite
HARVARD Citation
Straubinger, D. et al. (2019). Advances on high current load effects on lead-free solder joints of SMD chip-size components and BGAs. Circuit world. 45 (1), pp. 37-44. [Online].
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Straubinger, D. et al. (2019). Advances on high current load effects on lead-free solder joints of SMD chip-size components and BGAs. Circuit world. 45 (1), pp. 37-44. [Online].