Experimental analysis of thin vapor chamber with composite wick structure under different cooling conditions. (25th June 2019)
- Record Type:
- Journal Article
- Title:
- Experimental analysis of thin vapor chamber with composite wick structure under different cooling conditions. (25th June 2019)
- Main Title:
- Experimental analysis of thin vapor chamber with composite wick structure under different cooling conditions
- Authors:
- Li, Yong
Zhou, Wenjie
Li, Zixi
Chen, Zhaoshu
Gan, Yunhua - Abstract:
- Highlights: A composite wick with multi-artery structure is developed for thin vapor chambers. Different evaporator and condenser wicks are designed to enhance the performance. The influence of cooling condition on the vapor chamber performance is evaluated. The effects of wick structure and filling ratio on vapor chamber are investigated. Abstract: In this work, two types of thin vapor chambers, namely, copper foam vapor chamber (CFVC) and copper mesh vapor chamber (CMVC), are developed to enhance the thermal performance of vapor chambers for cooling high heat flux electronic devices. The evaporator wick is a composite wick of sintered copper powder-mesh with multi-artery structures made of several sintered powder bars on a thin evaporator zone. The condenser wicks for CFVC and CMVC are copper foam wick and 3-layer 200 mesh wick, respectively. A water-cooled testing system is set up to investigate the thermal performance of the vapor chamber. The characteristic parameters, including the temperature distribution, thermal resistance, filling ratio and critical heat flux (CHF) of vapor chambers are studied. The results indicate that the thermal performance of the vapor chamber is significantly affected by the cooling water temperature. At cooling water temperatures of 50 and 30 °C, the CHF of the CFVC can reach 180 W/cm 2, which is increased by 100–200% compared to that of the CMVC. The CFVC exhibits a better heat transfer performance and adaptability to the cooling waterHighlights: A composite wick with multi-artery structure is developed for thin vapor chambers. Different evaporator and condenser wicks are designed to enhance the performance. The influence of cooling condition on the vapor chamber performance is evaluated. The effects of wick structure and filling ratio on vapor chamber are investigated. Abstract: In this work, two types of thin vapor chambers, namely, copper foam vapor chamber (CFVC) and copper mesh vapor chamber (CMVC), are developed to enhance the thermal performance of vapor chambers for cooling high heat flux electronic devices. The evaporator wick is a composite wick of sintered copper powder-mesh with multi-artery structures made of several sintered powder bars on a thin evaporator zone. The condenser wicks for CFVC and CMVC are copper foam wick and 3-layer 200 mesh wick, respectively. A water-cooled testing system is set up to investigate the thermal performance of the vapor chamber. The characteristic parameters, including the temperature distribution, thermal resistance, filling ratio and critical heat flux (CHF) of vapor chambers are studied. The results indicate that the thermal performance of the vapor chamber is significantly affected by the cooling water temperature. At cooling water temperatures of 50 and 30 °C, the CHF of the CFVC can reach 180 W/cm 2, which is increased by 100–200% compared to that of the CMVC. The CFVC exhibits a better heat transfer performance and adaptability to the cooling water temperature, given that the copper foam wick has a larger capillary performance parameter and a smaller contact thermal resistance. … (more)
- Is Part Of:
- Applied thermal engineering. Volume 156(2019)
- Journal:
- Applied thermal engineering
- Issue:
- Volume 156(2019)
- Issue Display:
- Volume 156, Issue 2019 (2019)
- Year:
- 2019
- Volume:
- 156
- Issue:
- 2019
- Issue Sort Value:
- 2019-0156-2019-0000
- Page Start:
- 471
- Page End:
- 484
- Publication Date:
- 2019-06-25
- Subjects:
- Vapor chamber -- Wick structure -- Multi-artery -- Filling ratio -- Thermal performance
Heat engineering -- Periodicals
Heating -- Equipment and supplies -- Periodicals
Periodicals
621.40205 - Journal URLs:
- http://www.sciencedirect.com/science/journal/13594311 ↗
http://www.elsevier.com/homepage/elecserv.htt ↗
http://www.elsevier.com/journals ↗ - DOI:
- 10.1016/j.applthermaleng.2019.04.094 ↗
- Languages:
- English
- ISSNs:
- 1359-4311
- Deposit Type:
- Legaldeposit
- View Content:
- Available online (eLD content is only available in our Reading Rooms) ↗
- Physical Locations:
- British Library DSC - 1580.101000
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British Library HMNTS - ELD Digital store - Ingest File:
- 10590.xml