Cyanate ester resin based composites with high toughness and thermal conductivity. Issue 10 (15th February 2019)

• Record Type: Journal Article
• Authors: Zhai, Le; Liu, Zhenxin; Li, Chen; Qu, Xiongwei; Zhang, Qingxin; Li, Guohua; Zhang, Xiaojie; Abdel-Magid, Beckry
• Is Part Of: RSC advances. Volume 9:Issue 10(2019)
• Page Start: 5722
• Page End: 5730
• Publication Date: 2019-02-15
• Subjects: Chemistry -- Periodicals; 540.5
• DOI: 10.1039/c8ra10244a
• Languages: English
• ISSNs: 2046-2069

Abstract

Abstract : h-BN particles were used to fabricate cyanate ester/core–shell structured polyacrylic/BN composites. The impact strength and the thermal conductivity of the composites were simultaneously increased, which may be used in microelectronic packaging. Abstract : A new cyanate ester resin-based composite with higher toughness and thermal conductivity was developed. First, a poly( n -butyl acrylate)/poly(methyl methacrylate- co -acrylamide) (PBMAM) core–shell structured latex was prepared by seeded emulsion polymerization. Second, hexagonal boron nitride (h-BN) particles were modified by a surface coupling agent, 3-(2-amino ethyl amino)propyl trioxysilane, to improve the dispersion in cyanate ester resin (BADCy). Third, PBMAM and the modified boron nitride were mixed with BADCy resin to increase mechanical properties and thermal conductivity. The monomer conversion in the emulsion polymerization process of the PBMAM was monitored by determining the solid content. Its particle size was characterized by dynamic laser scattering, and the morphology of the particles was characterized using scanning and transmission electron microscopes. The modified boron nitride (ABN) was verified by FTIR and TGA measurements. The mechanical properties and thermal conductivity of the BADCy/PBMAM/ABN composites were determined at various BN contents. Results showed that the unnotched impact strength of the composite increased by 151% and the thermal conductivity increased by 85% at a PBMAM content of 5 wt% and ABN content of 6 wt%. With the enhanced properties and ease of fabrication, the developed composites have good potential for application in high-end industries such as microelectronic packaging.