Thermal-Aware Scheduling for Future Chip Multiprocessors. (11th April 2007)
- Record Type:
- Journal Article
- Title:
- Thermal-Aware Scheduling for Future Chip Multiprocessors. (11th April 2007)
- Main Title:
- Thermal-Aware Scheduling for Future Chip Multiprocessors
- Authors:
- Stavrou, Kyriakos
Trancoso, Pedro - Other Names:
- Nunez Antonio Academic Editor.
- Abstract:
- Abstract : The increased complexity and operating frequency in current single chip microprocessors is resulting in a decrease in the performance improvements. Consequently, major manufacturers offer chip multiprocessor (CMP) architectures in order to keep up with the expected performance gains. This architecture is successfully being introduced in many markets including that of the embedded systems. Nevertheless, the integration of several cores onto the same chip may lead to increased heat dissipation and consequently additional costs for cooling, higher power consumption, decrease of the reliability, and thermal-induced performance loss, among others. In this paper, we analyze the evolution of the thermal issues for the future chip multiprocessor architectures and show that as the number of on-chip cores increases, the thermal-induced problems will worsen. In addition, we present several scenarios that result in excessive thermal stress to the CMP chip or significant performance loss. In order to minimize or even eliminate these problems, we propose thermal-aware scheduler (TAS) algorithms. When assigning processes to cores, TAS takes their temperature and cooling ability into account in order to avoid thermal stress and at the same time improve the performance. Experimental results have shown that a TAS algorithm that considers also the temperatures of neighboring cores is able to significantly reduce the temperature-induced performance loss while at the same time,Abstract : The increased complexity and operating frequency in current single chip microprocessors is resulting in a decrease in the performance improvements. Consequently, major manufacturers offer chip multiprocessor (CMP) architectures in order to keep up with the expected performance gains. This architecture is successfully being introduced in many markets including that of the embedded systems. Nevertheless, the integration of several cores onto the same chip may lead to increased heat dissipation and consequently additional costs for cooling, higher power consumption, decrease of the reliability, and thermal-induced performance loss, among others. In this paper, we analyze the evolution of the thermal issues for the future chip multiprocessor architectures and show that as the number of on-chip cores increases, the thermal-induced problems will worsen. In addition, we present several scenarios that result in excessive thermal stress to the CMP chip or significant performance loss. In order to minimize or even eliminate these problems, we propose thermal-aware scheduler (TAS) algorithms. When assigning processes to cores, TAS takes their temperature and cooling ability into account in order to avoid thermal stress and at the same time improve the performance. Experimental results have shown that a TAS algorithm that considers also the temperatures of neighboring cores is able to significantly reduce the temperature-induced performance loss while at the same time, decrease the chip's temperature across many different operation and configuration scenarios. … (more)
- Is Part Of:
- EURASIP journal on embedded systems. Volume 2007(2007)
- Journal:
- EURASIP journal on embedded systems
- Issue:
- Volume 2007(2007)
- Issue Display:
- Volume 2007, Issue 2007 (2007)
- Year:
- 2007
- Volume:
- 2007
- Issue:
- 2007
- Issue Sort Value:
- 2007-2007-2007-0000
- Page Start:
- Page End:
- Publication Date:
- 2007-04-11
- Subjects:
- Embedded computer systems -- Periodicals
Systèmes enfouis (Informatique)
Embedded computer systems
Periodicals
Electronic journals
006.22 - Journal URLs:
- https://link.springer.com/journal/13639 ↗
http://link.springer.com/ ↗ - DOI:
- 10.1155/2007/48926 ↗
- Languages:
- English
- ISSNs:
- 1687-3955
- Deposit Type:
- Legaldeposit
- View Content:
- Available online (eLD content is only available in our Reading Rooms) ↗
- Physical Locations:
- British Library DSC - BLDSS-3PM
British Library HMNTS - ELD Digital store - Ingest File:
- 10298.xml