Influences of Bath Chemistry and Plating Variables on Characteristics of Electroless Ni–P Films on Si Wafers from Alkaline Citrate Solutions. (27th September 2018)

• Record Type: Journal Article
• Authors: Miao, Naiming; Jiang, Jinjin; Wu, Wangping
• Other Names: Sun Xuping Academic Editor.
• Is Part Of: Journal of nanomaterials. Volume 2018(2018)
• Publication Date: 2018-09-27
• Subjects: Nanostructured materials -- Periodicals; Nanotechnology -- Periodicals; Nanomatériaux; Nanostructured materials; Nanotechnology; Nanostructures; Nanotechnology; Periodicals; Fulltext; Internet Resources; Periodicals; 620.115
• DOI: 10.1155/2018/1817542
• Languages: English
• ISSNs: 1687-4110

Abstract

Abstract : Electroless nickel–phosphorus (Ni–P) films were produced on the surface of p-type monocrystalline silicon in the alkaline citrate solutions. The influences of bath chemistry and plating variables on the chemical composition, deposition rate, morphology, and thermal stability of electroless Ni–P films on silicon wafers were studied. The as-deposited Ni–P films were almost all medium- and high-P deposits. The concentrations of Ni 2+ and citric ions influenced the deposition rate of the films but did not affect P content in the deposits. With increasingH 2 P O 2 − content, the P content and deposition rate were steadily increased. The pH and plating temperature had a significant effect on the chemical composition and the deposition rate of the films. The thermal stability of the medium-P film was better than that of the high-P deposit. At the same time, the proposed mechanism of Ni–P films on monocrystalline silicon substrates in the alkaline bath solution was discussed and addressed.