Cite
HARVARD Citation
Ishizuka, M. et al. (2011). Application of Thermal Network Model to Transient Thermal Analysis of Power Electronic Package Substrate. Active and passive electronic components. p. . [Online].
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Ishizuka, M. et al. (2011). Application of Thermal Network Model to Transient Thermal Analysis of Power Electronic Package Substrate. Active and passive electronic components. p. . [Online].