An experimental investigation of flat polishing with dielectrophoretic (DEP) effect of slurry. Issue 5 (May 2016)

• Record Type: Journal Article
• Authors: Zhao, Tianchen; Deng, Qianfa; Yuan, Julong; Lyu, Binghai; Lin, Yibo
• Is Part Of: International journal of advanced manufacturing technology. Volume 84:Issue 5/8(2016)
• Page Start: 1737
• Page End: 1746
• Publication Date: 2016-05
• Subjects: Dielectrophoresis (DEP) -- Non-uniform electric field -- Polishing -- Efficiency -- Uniformity; Manufacturing processes -- Periodicals; Production engineering -- Periodicals; 670.427
• DOI: 10.1007/s00170-016-8372-3
• Languages: English
• ISSNs: 0268-3768

Abstract

Abstract Dielectrophoresis polishing (DEPP) is a novel flat polishing technology which utilizes the dielectrophoretic (DEP) effect to reduce the centrifugal force on the slurry and to obtain a higher polishing efficiency. The mechanism of the DEPP was analyzed in this paper; the motion of slurry being acted upon by DEP force in non-uniform electric field was captured in real-time with a specially designed video recording system to show the influence of electric field intensity and frequency upon DEP force. DEPP and traditional CMP were investigated. These processes were carried out in sequence on the same machine with the same slurry. Compared with traditional CMP, the efficiency of DEPP was improved by about onefold and the better surface uniformity of silicon wafer was obtained. The final surface roughnessR a of silicon wafer was measured at 1.2 nm.