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Global Dispatches: Latest from the 6th Annual Thin‐Wall Packaging Conference North America: From coffee pods to bioresins to thermoforming and injection molding, speakers covered a broad landscape of thin‐wall‐related topics. Issue 8 (1st September 2017)
Record Type:
Journal Article
Title:
Global Dispatches: Latest from the 6th Annual Thin‐Wall Packaging Conference North America: From coffee pods to bioresins to thermoforming and injection molding, speakers covered a broad landscape of thin‐wall‐related topics. Issue 8 (1st September 2017)
Main Title:
Global Dispatches: Latest from the 6th Annual Thin‐Wall Packaging Conference North America