Cite
HARVARD Citation
Fellner, K. et al. (2014). Method development for the cyclic characterization of thin copper layers for PCB applications. Circuit world. 40 (2), pp. 53-60. [Online].
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Fellner, K. et al. (2014). Method development for the cyclic characterization of thin copper layers for PCB applications. Circuit world. 40 (2), pp. 53-60. [Online].