Hybrid Materials: Flexible and Ultrasoft Inorganic 1D Semiconductor and Heterostructure Systems Based on SnIP (Adv. Funct. Mater. 18/2019). (2nd May 2019)

• Record Type: Journal Article
• Authors: Ott, Claudia; Reiter, Felix; Baumgartner, Maximilian; Pielmeier, Markus; Vogel, Anna; Walke, Patrick; Burger, Stefan; Ehrenreich, Michael; Kieslich, Gregor; Daisenberger, Dominik; Armstrong, Jeff; Thakur, Ujwal Kumar; Kumar, Pawan; Chen, Shunda; Donadio, Davide; Walter, Lisa S.; Weitz, R. Thomas; Shankar, Karthik; Nilges, Tom
• Is Part Of: Advanced functional materials. Volume 29:Number 18(2019)
• Page Start: n/a
• Page End: n/a
• Publication Date: 2019-05-02
• Subjects: 1D materials -- core–shell particles -- hybrid materials -- inorganic double helix semiconductor SnIP -- water splitting; Materials -- Periodicals; Chemical vapor deposition -- Periodicals; 620.11
• DOI: 10.1002/adfm.201970120
• Languages: English
• ISSNs: 1616-301X

Abstract

Abstract : In article number1900233, Gregor Kieslich, Karthik Shankar, Tom Nilges, and co‐workers, prepare organic and inorganic hybrids, illustrating that SnIP is a candidate to fabricate flexible 1D composites for energy conversion and water splitting applications. SnIP@C3 N4 hybrid forms an unusual soft material core–shell topology with graphenic carbon nitride wrapping around SnIP.