Study on the high temperature deformation measurement using the mark shearing technique. (21st July 2015)

• Record Type: Journal Article
• Authors: Wang, Huaixi; Xie, Huimin; Dai, Xianglu; Wu, Lifu
• Is Part Of: Measurement science & technology. Volume 26:Number 9(2015:Sep.)
• Publication Date: 2015-07-21
• Subjects: high temperature deformation -- mark shearing technique -- GH4037; Physical measurements -- Periodicals; Scientific apparatus and instruments -- Periodicals; Equipment and Supplies -- Periodicals; Science -- instrumentation -- Periodicals; Technology -- instrumentation -- Periodicals; Mesures physiques -- Périodiques; Physical measurements; Scientific apparatus and instruments; Periodicals; 502.87
• DOI: 10.1088/0957-0233/26/9/095401
• Languages: English
• ISSNs: 0957-0233

Abstract

Abstract: The mark shearing technique has been successfully utilized for room-temperature strain measurement in solid mechanics research. However, when the method is applied to deformation measurement at high temperature, some new issues will occur. From our experience, we have found that an inevitable thermal radiation will emit from the oven in the measurement and may lead to a distortion of the measuring system. As a result, an undesired measurement error will arise; furthermore, the oxidation resistance marker is crucial to obtain an ideal result. In order to solve the abovementioned issues, the mark shearing techniques for high-temperature deformation measurement are studied in this work, and a novel method for fabricating the marker pattern is proposed, which can be utilized to fabricate a deformation carrier for high temperature on a different specimen surface. In combination with this marker with our self-developed mark shearing system, the high-temperature (1000 °C) mechanical properties of the high-temperature nickel alloy (GH4037) was measured. In order to characterize the thermal deformation caused by the oven during the high temperature experiment, the surface temperature distribution of the mark shearing system is measured by an infrared camera. On the basis of this result, the corresponding thermal deformation is analyzed by the finite element analysis (FEM) method. From the analysis result, we can conclude that the virtual strain of the system incurred by thermal radiation cannot be ignored for a long-time measurement.