Cite
HARVARD Citation
Abadie, K. et al. (2019). Application of temporary adherence to improve the manufacturing of 3D thin silicon wafers. International journal of adhesion & adhesives. pp. 123-130. [Online].
This is an interim version of our Electronic Legal Deposit Catalogue-eJournals and eBooks while we continue to recover from a cyber-attack.
Abadie, K. et al. (2019). Application of temporary adherence to improve the manufacturing of 3D thin silicon wafers. International journal of adhesion & adhesives. pp. 123-130. [Online].