Ionic liquid pre-intercalated MXene films for ionogel-based flexible micro-supercapacitors with high volumetric energy density. Issue 16 (3rd April 2019)

• Record Type: Journal Article
• Authors: Zheng, Shuanghao; Zhang, Chuanfang (John); Zhou, Feng; Dong, Yanfeng; Shi, Xiaoyu; Nicolosi, Valeria; Wu, Zhong-Shuai; Bao, Xinhe
• Is Part Of: Journal of materials chemistry. Volume 7:Issue 16(2019)
• Page Start: 9478
• Page End: 9485
• Publication Date: 2019-04-03
• Subjects: Materials -- Research -- Periodicals; Chemistry, Analytic -- Periodicals; Environmental sciences -- Research -- Periodicals; 543.0284
• DOI: 10.1039/c9ta02190f
• Languages: English
• ISSNs: 2050-7488

Abstract

Abstract : Ionogel-based flexible micro-supercapacitors are constructed based on interdigital microelectrodes of ionic liquid pre-intercalated MXene compact films. Abstract : MXenes are emerging as a very promising electrode material of high-performance micro-supercapacitors (MSCs) for microscale electronics. However, MXene based MSCs (M-MSCs) reported so far exhibit low areal (≤10 μW h cm −2 ) and volumetric (≤20 mW h cm −3 ) energy densities due to their narrow working voltage in aqueous systems (0.6–1.0 V). Herein, we report for the first time the construction of high-voltage and high-energy flexible ionogel-based M-MSCs with interdigital microelectrodes of ionic liquid pre-intercalated MXene films. Benefitting from the pre-intercalation of ionic liquid, the as-fabricated M-MSCs, working at 3 V in 1-ethyl-3-methylimidazolium tetrafluoroborate (EMIMBF4 ), exhibited high areal and volumetric energy densities of 13.9 μW h cm −2 and 43.7 mW h cm −3, respectively, both of which are among the highest values for the reported M-MSCs. Moreover, all-solid-state M-MSCs using ionogel electrolytes displayed exceptional flexibility without capacitance loss under various deformation conditions and seamless integration free of metal-based interconnections for boosting voltage output. Therefore, such high-energy M-MSCs hold great potential for direct integration of flexible and miniature electronics.