Cite
HARVARD Citation
Jiang, S. et al. (2019). Microstructural and textural evolutions in multilayered Ti/Cu composites processed by accumulative roll bonding. Journal of materials science & technology. 35 (6), pp. 1165-1174. [Online].
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Jiang, S. et al. (2019). Microstructural and textural evolutions in multilayered Ti/Cu composites processed by accumulative roll bonding. Journal of materials science & technology. 35 (6), pp. 1165-1174. [Online].