Enhanced thermal conductivity of SiCp/PS composites by electrospinning–hot press technique. (December 2015)

• Record Type: Journal Article
• Authors: Gu, Junwei; Lv, Zhaoyuan; Wu, Yalan; Zhao, Ruoxi; Tian, Lidong; Zhang, Qiuyu
• Is Part Of: Composites. Volume 79(2015)
• Page Start: 8
• Page End: 13
• Publication Date: 2015-12
• Subjects: A. Polymer-matrix composites (PMCs) -- B. Thermal properties -- E. Compression moulding; Composite materials -- Periodicals; Manufacturing processes -- Periodicals; Composite materials; Manufacturing processes; Periodicals; 620.11805
• DOI: 10.1016/j.compositesa.2015.09.005
• Languages: English
• ISSNs: 1359-835X

Abstract

Abstract: Silicon carbide particle/polystyrene (SiCp/PS) electrospun mats are firstly prepared by electrospinning technology, then to be fabricated the corresponding thermally conductive SiCp/PS composites by the method of "laminating-hot press". The mass fraction of SiCp and laminating mode of SiCp/PS electrospun mats affecting on the thermal conductivities, dielectric and thermal properties of the composites are investigated. The addition of 32.8 vol% SiCp improves the thermally conductive coefficient λ of pure PS from 0.182 to 0.566 W/m K and thermal diffusivity of pure PS from 0.169 to 0.376 mm 2 /s, whereas the dielectric constant values still remain at relatively low levels. The thermal stabilities of the SiCp/PS composites are increased with the increasing addition of SiCp. For a given SiCp loading, the SiCp/PS composites from warp–weft arrangement of SiCp/PS electrospun mats possess relative higher thermally conductive coefficient λ and dielectric constant values than those of SiCp/PS composites from warp–warp arrangement of SiCp/PS electrospun mats.