Effect of crystal orientation on indentation-induced residual stress field: Simulation and experimental validation. (5th May 2019)

• Record Type: Journal Article
• Authors: Breumier, S.; Villani, A.; Maurice, C.; Lévesque, M.; Kermouche, G.
• Is Part Of: Materials & design. Volume 169(2019)
• Publication Date: 2019-05-05
• Subjects: High Angular Resolution Electron Back-Scattered diffraction -- Crystal plasticity finite element -- Single crystal -- Shot-peening; Materials -- Periodicals; Engineering design -- Periodicals; Matériaux -- Périodiques; Conception technique -- Périodiques; Electronic journals; 620.11
• DOI: 10.1016/j.matdes.2019.107659
• Languages: English
• ISSNs: 0264-1275

Abstract

Abstract: Experimental determination of local residual stress fields beneath a spherical indent on a ⟨001⟩ copper single crystal revealed the presence of a significant tensile residual stress zone. This finding was adequately reproduced by Crystal Plasticity Finite Element simulations. Further simulations of one spherical indent on many other crystal orientations showed a strong variation of the residual stress field with crystal orientation. Accumulative effects of five superposing indents were simulated on two extreme orientations ⟨001⟩ and ⟨111⟩. The simulations showed that plastic anisotropy is responsible for potentially uneven compressive residual stresses after surface mechanical treatments. Graphical Abstract: Highlights: Indentation-induced residual stress field on copper single crystal presents significant subsurface tensile stresses for several crystal orientations. Such tensile stresses result from crystal plasticity anisotropy. Residual stress field after five indents still exhibits a crystal orientation-dependent behavior. Effects of crystal orientation on indentation-induced residual stress field can be quantified through inverse pole figure mapping.