A novel 96.5Sn3Cu0.5Mn nanosolder with enhanced wettability applied to nanosoldering of WO3 nanomaterial. (28th February 2019)

• Record Type: Journal Article
• Authors: Zhang, Xuan; Zhang, Hong; Zheng, Xiujun; Walls, Michael; Peng, Yong
• Is Part Of: Nanotechnology. Volume 30:Number 19(2019)
• Publication Date: 2019-02-28
• Subjects: nanosolder -- SnCuMn alloy -- wettability -- soldering interface; Nanotechnology -- Periodicals; Nanotechnology -- Periodicals; Nanotechnology; Publications périodiques; Nanotechnologies; Periodicals; 620.5
• DOI: 10.1088/1361-6528/ab030c
• Languages: English
• ISSNs: 0957-4484

Abstract

Abstract: Nano-soldering relying on a sacrificial nanosolder, is a flexible interconnection technique, having promising applications in joining nanosized functional materials; that is an essential step in the assembly of nano-devices. In a soldering, the wettability is important in the bonding of two nanomaterial, which determines the quality of the junction. Tungsten trioxide nanomaterial has unique characteristics such as electro-, opto-, gaso-chromic. To assemble this nanomaterial into functional nano-devices, a superior nanosolder is necessary. The conventional SnCu nanosolder has been chosen, but its wetting on WO3 is unsatisfactory. Here, our study indicates that the SnCu wettability on WO3 material has been improved greatly by adding minor manganese, in which the contact angle has a significant change from 73.2° to 41.7°. Then the wetting mechanism is investigated by observing the soldering interface. Lastly, a more robust and higher-reliable junction has been obtained by thermal soldering two individual WO3 nano-objects into a cross-shaped pattern.