Microelectronics, Nanoelectronics: step behind the red brick wall using the thermal domain. (2019)

• Record Type: Journal Article
• Authors: Mizsei, J.; Lappalainen, J.
• Is Part Of: Materials today. Volume 7:Part 3(2019)
• Page Start: 888
• Page End: 893
• Publication Date: 2019
• Subjects: Bit representation -- More-than-Moore -- thermal-electronics -- metal-insulator transition (MIT) -- semiconductor-metal transition (smt); Materials science -- Congresses -- Periodicals; 620.1
• DOI: 10.1016/j.matpr.2018.12.089
• Languages: English
• ISSNs: 2214-7853

Abstract

Abstract: The More-than-Moore Grand Challenge is a hot topic of present day solid state electronics: one way to step behind the "red brick wall" is the 3D heterogeneous integration of different systems with the conventional (standard) CMOS-technology. The aim of this study is to summarize the different bit representation methods, especially possibilities of our new, patented phonsistor (phonon transistor) based thermal-electronic logic system or thermal-electronic logic circuit (TELC). TELC is the first logic gate approach using two different physical quantities, i.e. electrical and thermal for bit representation within one system