Evaluation of mechanical and thermal properties of tamarind seed filler reinforced vinyl ester composites. (24th January 2019)

• Record Type: Journal Article
• Authors: Stalin, Balasubramaniam; Nagaprasad, Nagaraj; Vignesh, Venkataraman; Ravichandran, Manickam
• Is Part Of: Journal of vinyl & additive technology. Volume 25(2019)Supplement 2
• Page Start: E114
• Page End: E128
• Publication Date: 2019-01-24
• Subjects: Vinyl polymers -- Periodicals; Plastics -- Additives -- Periodicals; 668.4236
• DOI: 10.1002/vnl.21701
• Languages: English
• ISSNs: 1083-5601

Abstract

Abstract : This article deals with the usage of tamarind seed filler (TSF) as reinforcement in vinyl ester (VE) composites. The composite plates have been fabricated by compression molding machine with TSFs of varying wt% from 5 to 50 as reinforcement material, and their properties such as tensile, flexural, impact, hardness, water absorption, heat deflection tests, and thermogravimetric analysis are studied. The mechanical properties of TSF reinforced VE composites are optimum at 15 wt% filler. The tensile strength and flexural strength of TSF‐VE composites are estimated to be around 34.1 and 121 MPa, respectively. The better impact strength of TSF‐VE composites is found to be 14.02 kJ/m 2, and barcol hardness can hold a value up to 42.33. Thermo gravimetric analysis and heat deflection test of TSF reinforced VE composite have improved the thermal stability. The fiber matrix interaction of the fractured mechanical testing specimen has been analyzed by scanning electron microscope. The TSF‐VE composites are used to fabricate the wheel hubcap of heavy‐duty buses, bus seat backrest cover, and silencer guard of the motorcycle. J. VINYL ADDIT. TECHNOL., 25:E114–E128, 2019. © 2019 Society of Plastics Engineers