Conceptual design of efficient heat conductors using multi-material topology optimization. Issue 5 (4th May 2019)

• Record Type: Journal Article
• Authors: Park, Jaejong; Nguyen, Tam H.; Shah, Jami J.; Sutradhar, Alok
• Is Part Of: Engineering optimization. Volume 51:Issue 5(2019)
• Page Start: 796
• Page End: 814
• Publication Date: 2019-05-04
• Subjects: Heat conduction -- cooling -- multi-material -- multi-resolution -- topology optimization; Engineering design -- Periodicals; Mathematical optimization -- Periodicals; 620.0042
• DOI: 10.1080/0305215X.2018.1497613
• Languages: English
• ISSNs: 0305-215X

Abstract

ABSTRACT: Conductive heat transfer plays an important role in dissipating thermal energy to achieve lower operating temperatures in various devices. Topology optimization has the potential to provide efficient structural solutions for such devices. The traditional topology optimization approach considers a single material. Adding additional materials with unique properties not only can expand the design options but also may improve the structural performance of the final structure. In this work, a multi-resolution topology optimization approach is employed to design multi-material structures for efficient heat dissipation. The implementation blends an efficient multi-resolution approach to obtain high-resolution designs with an alternating active phase algorithm to handle multi-material giving greater design flexibility. It solves the steady-state heat equation using finite element analysis and iteratively minimizes thermal compliance (maximizes conductivity). Several examples are presented to show the efficacy of the numerical implementation, which involves benchmark problems. Results indicate good prospects when quantitatively compared with single-material structures.