Cite
HARVARD Citation
Hou, X. et al. (2019). Additional grain boundary strengthening in length-scale architectured copper with ultrafine and coarse domains. Scripta materialia. pp. 55-59. [Online].
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Hou, X. et al. (2019). Additional grain boundary strengthening in length-scale architectured copper with ultrafine and coarse domains. Scripta materialia. pp. 55-59. [Online].